ML conf EU

ML conf EU 2020

Chip and equipment manufacturing and tracking is a tough task given the strict adherence to quality standards and processes like six-sigma control checks. In this session, we will be looking at key real-world problems from Semiconductor &amp; Manufacturing, and possible methodologies where we leveraged a combination of traditional computer vision techniques and coupled it with the power of deep transfer learning and machine \ deep learning. We will be covering two main use-cases from the Industry: Automatic Defect detection at NanoscaleDefect Clustering at Nanoscale <a href="https://www.froala.com/wysiwyg-editor?pb=1"> </a>